Micro-chimney and thermosiphon die-level cooling

Details Micro-chimney and thermosiphon die-level cooling Micro-chimney and thermosiphon die-level cooling

2011-08-30

2011-08-30

Ciric, Ljiljana (Lil) V (Department: 3785)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S104210, C165S185000, C361S700000, C361S702000, C257S707000, C257S713000, C029S890032

Reexamination Certificate

active

08006747

ABSTRACT:
A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area.

REFERENCES:
patent: 3678995 (1972-07-01), Collard
patent: 3852806 (1974-12-01), Corman et al.
patent: 4204246 (1980-05-01), Arii et al.
patent: 4234638 (1980-11-01), Yamazoe et al.
patent: 4327399 (1982-04-01), Sasaki et al.
patent: 4519447 (1985-05-01), Wiech, Jr.
patent: 4782893 (1988-11-01), Thomas
patent: 4858073 (1989-08-01), Gregory
patent: 4970868 (1990-11-01), Grebe et al.
patent: 4995451 (1991-02-01), Hamburgen
patent: 5142441 (1992-08-01), Seibold et al.
patent: 5172301 (1992-12-01), Schneider
patent: 5216580 (1993-06-01), Davidson et al.
patent: 5232047 (1993-08-01), Matthews
patent: 5265321 (1993-11-01), Nelson et al.
patent: 5283715 (1994-02-01), Carlsten et al.
patent: 5328087 (1994-07-01), Nelson et al.
patent: 5349498 (1994-09-01), Tanzer et al.
patent: 5355942 (1994-10-01), Conte
patent: 5386143 (1995-01-01), Fitch
patent: 5396947 (1995-03-01), Itoh
patent: 5445308 (1995-08-01), Nelson et al.
patent: 5450283 (1995-09-01), Lin et al.
patent: 5542471 (1996-08-01), Dickinson
patent: 5582242 (1996-12-01), Hamburgen et al.
patent: 5629840 (1997-05-01), Hamburgen et al.
patent: 5660917 (1997-08-01), Fujimori et al.
patent: 5727619 (1998-03-01), Yao et al.
patent: 5780928 (1998-07-01), Rostoker et al.
patent: 5793611 (1998-08-01), Nakazato et al.
patent: 5944097 (1999-08-01), Gungor et al.
patent: 6008987 (1999-12-01), Gale et al.
patent: 6062302 (2000-05-01), Davis et al.
patent: 6075701 (2000-06-01), Ali et al.
patent: 6208513 (2001-03-01), Fitch et al.
patent: 6219237 (2001-04-01), Geusic et al.
patent: 6230790 (2001-05-01), Hemingway et al.
patent: 6237223 (2001-05-01), McCullough
patent: 6292366 (2001-09-01), Platt
patent: 6374905 (2002-04-01), Tantoush
patent: 6377457 (2002-04-01), Seshan et al.
patent: 6437981 (2002-08-01), Newton et al.
patent: 6448509 (2002-09-01), Huemoeller
patent: 6490159 (2002-12-01), Goenka et al.
patent: 6503626 (2003-01-01), Norley et al.
patent: 6621701 (2003-09-01), Tamba et al.
patent: 6623279 (2003-09-01), Derian et al.
patent: 6661659 (2003-12-01), Tamba et al.
patent: 6665187 (2003-12-01), Alcoe et al.
patent: 6666260 (2003-12-01), Tantoush
patent: 6686532 (2004-02-01), Macris
patent: 6727422 (2004-04-01), Macris
patent: 6743972 (2004-06-01), Macris
patent: 6788537 (2004-09-01), Saita et al.
patent: 6825557 (2004-11-01), DiBattista et al.
patent: 6841491 (2005-01-01), Sadoughi et al.
patent: 6939505 (2005-09-01), Musso et al.
patent: 7001782 (2006-02-01), Diana et al.
patent: 7064963 (2006-06-01), Oman et al.
patent: 7117930 (2006-10-01), Todd et al.
patent: 7120022 (2006-10-01), Belady et al.
patent: 7224057 (2007-05-01), Yang
patent: 7295441 (2007-11-01), Laio et al.
patent: 7303005 (2007-12-01), Reis et al.
patent: 7324341 (2008-01-01), Oman
patent: 7390698 (2008-06-01), Thornton et al.
patent: 7459346 (2008-12-01), Yee et al.
patent: 7560371 (2009-07-01), Dando et al.
patent: 7846778 (2010-12-01), Rumer et al.
patent: 2002/0063330 (2002-05-01), Macris
patent: 2003/0051868 (2003-03-01), Dishongh et al.
patent: 2003/0207495 (2003-11-01), Akram
patent: 2004/0081803 (2004-04-01), Rauch

Affiliated with

Also associated with

Rating

Micro-chimney and thermosiphon die-level cooling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micro-chimney and thermosiphon die-level cooling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro-chimney and thermosiphon die-level cooling will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2775278