Micro-bumps to enhance LGA interconnections

Details Micro-bumps to enhance LGA interconnections Micro-bumps to enhance LGA interconnections

2007-12-04

2007-12-04

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S846000

Reexamination Certificate

active

11204699

ABSTRACT:
An improved Land Grid Array interconnect structure is provided with the use of small metal bumps on the substrate electrical contact pad. The bumps interlock with segments of the fuzz button connection and increase the physical contact surface area between the contact pad and fuss button. The improved contact reduces displacement of electrical contact points due to thermo-mechanical stress and lowers the required actuation force during assembly.

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