Micro BGA stacking scheme

Details Micro BGA stacking scheme Micro BGA stacking scheme

1995-10-16

1997-01-28

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257723, 257778, H01L 2302

Patent

active

055980333

ABSTRACT:
There is provided an improved stacking scheme for micro-BGA packages so as to provide a high density integrated circuit package. The integrated circuit package assembly (300) includes a sheet-like interposer (312) which is formed of a main portion (312a) and an extension (312b) extending outwardly from the main portion. A plurality of lands (326) are disposed on the surface of the interposer extension. A plurality of masses (314) of electrically conductive bonding material of each of a plurality of packages overlie the lands on the interposer extension of the next lower package and are electrically connected thereto when the plurality of packages are stacked one atop the other.

REFERENCES:
patent: 5311407 (1994-05-01), Lumbard
patent: 5434452 (1995-07-01), Higgins, III

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