Mezzanine integrated circuit interconnect

Details Mezzanine integrated circuit interconnect Mezzanine integrated circuit interconnect

2005-08-23

2005-08-23

Luebke, Renee (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S091000

Reexamination Certificate

active

06932618

ABSTRACT:
An interconnect assembly to electrically interconnect one or more integrated circuits to an electronic device may comprise a base package to couple to a circuit board of the electronic device. A terminal mezzanine package may support the integrated circuit(s) above the base package. A first set of conductors of a first material and design carry low-frequency signals between the base and terminal connector packages. A second set of conductors of a second material and design carry high-frequency signals. In particular embodiments the base package may comprise a base mezzanine integrating one or more additional integrated circuits and intermediate mezzanines supporting one or more additional integrated circuits each and enabling multi-story modular interconnection structures. In particular embodiments, the second set of conductors may comprise columns of compressible polymer compound embedded with metallized particles, and the columns may be dispersed amongst pins and sockets of a pin-grid array.

REFERENCES:
patent: 5013249 (1991-05-01), Lindeman et al.
patent: 6027345 (2000-02-01), McHugh et al.
patent: 6168442 (2001-01-01), Naoi
patent: 2001/0049207 (2001-12-01), Sakata et al.

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