Metrology of bilayer photoresist processes

Details Metrology of bilayer photoresist processes Metrology of bilayer photoresist processes

2011-03-08

2011-03-08

Young, Christopher G (Department: 1721)

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

C430S292000, C430S313000, C430S323000, C382S145000, C382S149000, C382S151000

Reexamination Certificate

active

07901852

ABSTRACT:
A method for patterning a substrate is provided, which comprises (a) providing a substrate; (b) applying a first layer comprising a first photo resist to the substrate; (c) applying a second layer comprising a second photo resist over the first layer; (d) patterning the second layer; and (e) inspecting the patterned second layer with an inspection tool; wherein at least one of the first and second layers comprises a contrasting agent which increases the contrast between the first and second layers to the inspection tool.

REFERENCES:
patent: 6132644 (2000-10-01), Angelopoulos et al.
patent: 6858542 (2005-02-01), Sparks et al.
patent: 7052812 (2006-05-01), Wang et al.
patent: 7102656 (2006-09-01), Mirkin et al.
patent: 7166241 (2007-01-01), Angelopoulos et al.
patent: 7226740 (2007-06-01), Haugland et al.
patent: 2006/0122366 (2006-06-01), Wang et al.
patent: 2007/0249803 (2007-10-01), Mattes et al.
patent: 2007/0295398 (2007-12-01), On Too et al.
patent: 2008/0017834 (2008-01-01), Skulason et al.
patent: 2008/0023677 (2008-01-01), Frechet et al.
patent: 2008/0033146 (2008-02-01), Liu et al.

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