Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-02-10
1994-05-17
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
139 26, 139 30, 156644, 427306, 427307, H01K 310
Patent
active
053116607
ABSTRACT:
Disclosed is a method of drilling, desmearing, and additively circuitizing a printed circuit board. The printed circuit board is drilled under conditions which produce glass and polymer smeared vias and through holes. The particulate debris is removed by vapor blasting the drilled printed circuit board. Next the printed circuit board is soaked in a solvent to swell the drill smear on the circuit interplanes of the printed circuit board. This solvent is then removed by entrainment in a gas, and a stream of an aqueous, acidic, oxidizing solution is passed through the printed circuit board holes to remove swollen smear in the thru holes and produce an etchback of conductors. After a water rinse an aqueous reducing solution is passed through the printed circuit board to reduce and remove aqueous acidic oxidizing solution, e.g., residual aqueous acid oxidizing solution. The printed circuit board is rinsed to remove the aqueous reducing solution. The surface of the printed circuit board is then seeded, the intended circuitization is photolithographically defined on the printed circuit board, and the circuitization, including the surface circuitization and the plated through hole circuitization, is additively plated.
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"Printed Circuit Board Packaging", Donald P. Seraphim, Donald E. Barr, William T. chen, George P. Schmitt, and Rao R. Tummala, pp. 853-922, in Tummala and Rymaszewski, Microelectronics Packaging Handbook.
Alpaugh Warren A.
Bhatt Anilkumar C.
Canestaro Michael J.
Day Robert J.
Fey Edmond O.
Arbes Carl J.
Goldman Richard M.
International Business Machines - Corporation
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