Methods utilizing microwave radiation during formation of...

Semiconductor device manufacturing: process – Having selenium or tellurium elemental semiconductor component

Reexamination Certificate

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C438S306000, C438S795000, C257SE21090, C257SE21333, C257SE21409

Reexamination Certificate

active

07985617

ABSTRACT:
Some embodiments include methods in which microwave radiation is used to activate dopant and/or increase crystallinity of semiconductor material during formation of a semiconductor construction. In some embodiments, the microwave radiation has a frequency of about 5.8 gigahertz, and a temperature of the semiconductor construction does not exceed about 500° C. during the exposure to the microwave radiation.

REFERENCES:
patent: 4303455 (1981-12-01), Splinter et al.
patent: 6051483 (2000-04-01), Lee et al.
patent: 6133076 (2000-10-01), Yamazaki et al.
patent: 6528361 (2003-03-01), Ahn et al.
patent: 2002/0139979 (2002-10-01), Joo et al.
patent: 2003/0186519 (2003-10-01), Downey et al.
patent: 2006/0009018 (2006-01-01), Ikeda
patent: 2006/0228897 (2006-10-01), Timans
patent: 2007/0167029 (2007-07-01), Kowalski et al.
patent: 2008/0152938 (2008-06-01), Kelman et al.
patent: PCTUS2009054475 (2010-04-01), None
K. Thompson, et al., “Electromagnetic Annealing for the 100 n. Technology Node” IEEE Electron Device Letters, vol. 23, No. 3, Mar. 2002, pp. 127-129.

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