Methods using eddy current for calibrating a CMP tool

Details Methods using eddy current for calibrating a CMP tool Methods using eddy current for calibrating a CMP tool

2007-03-13

2007-03-13

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000

Reexamination Certificate

active

11270125

ABSTRACT:
Methods and apparatus are provided for calibrating a chemical mechanical polishing (“CMP”) tool having a polishing station with a platen, an eddy current probe disposed within the platen, a polishing pad coupled to the platen, and a metal element disposed within the polishing station and configured to be selectively moved proximate the polishing pad. The method includes the steps of determining a thickness measurement of the polishing pad and adjusting at least one tool parameter based, in part, upon the determined thickness measurement of the polishing pad.

REFERENCES:
patent: 6966816 (2005-11-01), Swedek et al.
patent: 2002/0164925 (2002-11-01), Swedek et al.

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