Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2004-08-09
2009-06-30
Coleman, W. David (Department: 2813)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C257SE21521, C174S251000, C174S267000
Reexamination Certificate
active
07553680
ABSTRACT:
An overmolded electronic assembly is provided having a circuit board with electronic devices and a diagnostic connection. The diagnostic connection includes electrical conductors having a distal end projecting above a first side of the circuit board, for example, circuit pads having solder thereon or conductive pins oriented substantially perpendicular to the circuit board. The electrical conductors are overmolded with sealing material along with the other electronic devices and circuit board area. The encapsulation or sealing material overlying the electrical conductors is removed from the outside surface down to at least the distal end of the electrical conductors. The sealing material may be removed, for example, by mechanical cutting, laser cutting, or high pressure jet erosion, for example, by a high pressure water or liquid nitrogen stream.
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Brandenburg Scott D.
Tsai Jeenhuei S.
Coleman W. David
Crawford Latanya
Delphi Technologies Inc.
Funke Jimmy L.
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