Methods to prevent mechanical flexure related BGA failure

Details Methods to prevent mechanical flexure related BGA failure Methods to prevent mechanical flexure related BGA failure

2007-04-10

2007-04-10

Vigushin, John B. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C257S718000, C257S719000, C257S727000, C257S778000, C438S108000, C438S122000, C029S830000, C029S832000

Reexamination Certificate

active

10738688

ABSTRACT:
Methods and associated apparatus of reducing stress in a package are described in which a package is provided comprising an array of interconnects that are connected to a substrate, and then reducing the stress of the interconnects located near a weak area in the package, during flexure of the substrate, by spring loading the weak area of the package.

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patent: 6724081 (2004-04-01), Ho et al.
patent: 6750551 (2004-06-01), Frutschy et al.
patent: 6836005 (2004-12-01), Moriwaki
patent: 2003/0150645 (2003-08-01), Chiu
patent: 2004/0010911 (2004-01-01), Kung et al.

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