Methods to minimize contact resistance

Details Methods to minimize contact resistance Methods to minimize contact resistance

2007-12-11

2007-12-11

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Having organic semiconductive component

C257SE21242

Reexamination Certificate

active

11187552

ABSTRACT:
A method is disclosed for making a metal electrode which minimizes the contact resistance between it and an organic semiconductor. Acid-stabilized metal nanoparticles are deposited upon a substrate and annealed. This creates a metal electrode and releases acid. Upon deposition of semiconductor and subsequent annealing, the acid diffuses from the electrode into the semiconductor layer and acts as a dopant, minimizing the contact resistance. The use of oleic acid-stabilized silver nanoparticles is demonstrated.

REFERENCES:
patent: 2003/0160230 (2003-08-01), Ong et al.

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