Metal working – Piezoelectric device making
Reexamination Certificate
2006-02-28
2009-08-18
Trinh, Minh (Department: 3729)
Metal working
Piezoelectric device making
C029S831000, C029S846000, C029S423000, C029S025420, C310S328000
Reexamination Certificate
active
07574787
ABSTRACT:
A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.
REFERENCES:
patent: 4233477 (1980-11-01), Rice et al.
patent: 4237399 (1980-12-01), Sakamoto
patent: 4649312 (1987-03-01), Robin et al.
patent: 4670682 (1987-06-01), Harnden, Jr. et al.
patent: 4991283 (1991-02-01), Johnson et al.
patent: 5034649 (1991-07-01), Chida et al.
patent: 5083056 (1992-01-01), Kondou et al.
patent: 5248912 (1993-09-01), Zdeblick et al.
patent: 5268611 (1993-12-01), Culp et al.
patent: 5430344 (1995-07-01), Takeuchi et al.
patent: 5486494 (1996-01-01), Hotchkiss et al.
patent: 5585136 (1996-12-01), Barrow et al.
patent: 5691593 (1997-11-01), Takeuchi et al.
patent: 5869189 (1999-02-01), Hagood, IV et al.
patent: 5950291 (1999-09-01), Gentilman et al.
patent: 6071795 (2000-06-01), Cheung et al.
patent: 6138348 (2000-10-01), Kulesza et al.
patent: 6262516 (2001-07-01), Fukuda et al.
patent: 6270202 (2001-08-01), Namba et al.
patent: 6335263 (2002-01-01), Cheung et al.
patent: 6367132 (2002-04-01), Chatterjee et al.
patent: 6370964 (2002-04-01), Chang et al.
patent: 6408513 (2002-06-01), Kitahara et al.
patent: 6476540 (2002-11-01), Takeuchi et al.
patent: 6597084 (2003-07-01), Hu et al.
patent: 6645830 (2003-11-01), Shimoda et al.
patent: 6666943 (2003-12-01), Wada et al.
patent: 6715192 (2004-04-01), Takeuchi et al.
patent: 6771007 (2004-08-01), Tanielian
patent: 7089635 (2006-08-01), Xu et al.
patent: 7176600 (2007-02-01), Buhler et al.
patent: 7234214 (2007-06-01), Xu et al.
patent: 7290336 (2007-11-01), Buhler et al.
patent: 2002/0036055 (2002-03-01), Yoshimura et al.
patent: 2002/0066525 (2002-06-01), Wada et al.
patent: 2002/0146893 (2002-10-01), Shimoda et al.
patent: 2002/0149296 (2002-10-01), Fujii et al.
patent: 0858110 (1998-08-01), None
patent: 63150979 (1988-06-01), None
patent: 02005325 (1990-01-01), None
patent: 04023370 (1990-01-01), None
patent: 02162782 (1990-06-01), None
patent: WO 99/48621 (1999-09-01), None
patent: WO 01/39253 (2001-05-01), None
EP Search Report, Application No. 07007909.0-2222; Dated Jun. 18, 2007, Examiner David Meacher, Munich, Germany.
Tsakalakos, L. et al.,Epitaxial Ferroelectric(Pb,La)(Zr Ti)O3Thin Films on Stainless Steel by Excimer Laser Liftoff, Applied Physics Letters, Jan. 10, 2000, vol. 76, No. 2, pp. 227-229.
Tsakalakos, L. et al.,Excimer Laser Liftoff of Epitaxial Pb(Zr, Ti)O3Thin Films and Heterostructures; Mat. Res. Soc. Symp. Proc., vol. 596, 2000 Materials Research Society, pp. 549-557; Ferroelectric Thin Films VIII, Nov. 29-Dec. 2, 1999.
Lukacs, M. et al.,Novel PZT Films for Ultrasound Biomicroscopy; 1996 IEEE Ultrasonics Symposium, pp. 901-904.
Barrow, et al.,Characterization of Thick Lead Zirconate Titanate Films Fabricated Using a New Sol Gel Based Process; J. Appl. Phys. 81 (2), Jan. 15, 1997, 1997 American Institute of Physics, pp. 876-881.
Wong, W.S., et al.,Integration of GaN Thin Films with Dissimilar Substrate Materials by Pd-In Metal Bonding and Laser Lift-Off; Journal of Electronic Materials, vol. 28, No. 12, 1999, pp. 1409-1413.
Chen, Yi-Chia, et al.,A Fluxless Bonding Technology Using Indium-Silver Multilayer Composites; IEEE Transactions on Components, Packaging, and Manufacturing Technology—Part A., vol. 20, No. 1, Mar. 1997, pp. 46-51.
Lee, Chin C., et al.,Au-In Bonding Below the Eutectic Temperature; IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, No. 3, May 1998, pp. 311-316.
Chen, Yi-Chia,Indium-Copper Multilayer Composites for Fluxless Oxidation-Free Bonding; Thin Solid Films 283 (1996), pp. 243-246; 1996 Elsevier Science S.A.
Sayer, M., et al.,Macroscopic Actuators Using Thick Piezoelectric Coatings; Mat. Res. Soc. Symp. Proc., vol. 655, 2001 Materials Research Society; pp. CC13.6.1-CC13.6.11.
Lin, Mark, et al.,The Manufacture of Composite Structures with a Built-in Network of Piezoceramics; Composites Science and Tecnnology, 62 (2002), pp. 919-939.
Zou, L. et al.,Sol-Gel Fabricated Thick Piezoelectric Ultrasonic Transducers for Potential Applications in Industrial Material Processes;1997 IEEE Ultrasonics Symposium, pp. 1007-1011.
European Search Report, Feb. 15, 2006, Application No. EP 04 004266.
Mathelin, D., et al.,Improved Microcontact Technology, The Compete Network presents Immico, (BE-8225), Up-dated: Spring 1998, pp. 1-9.
Qi, Wenkang et al., “Finite Element Study on Random Design of 2-2 Composite Transducer”, Proceedings of SPIE—The International Society for Optical Engineering 1997 Society of Photo-Optical Instrumentation Engineers, Bellingham, WA, US, vol. 3037, 1997, pp. 176-180.
Sundaresan, M.J. et al., “Methods of Distributed Sensing for Health Monitoring of Composite Material Structures”, Composites Part A: Applied Science and Manufacturing, Elsevier Science Publishers B.V., Amsterdam, NL, vol. 32, No. 9, Sep. 2001, pp. 1357-1374.
Tressler, J.F. et al., “Functional Composites for Sensors, Actuators and Transducers”, Composites Part A: Applied Science and Manufacturing, Elsevier Science Publishers B.V., Amsterdam, NL, vol. 30, No. 4, Apr. 1999, pp. 477-482.
Buhler Steven A.
Elrod Scott A.
Fitch John S.
Littau Karl A.
Solberg Scott E.
Fay Sharpe LLP
Palo Alto Research Center Incorporated
Trinh Minh
LandOfFree
Methods to make piezoelectric ceramic thick film array and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods to make piezoelectric ceramic thick film array and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods to make piezoelectric ceramic thick film array and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4056790