Drug – bio-affecting and body treating compositions – Topical body preparation containing solid synthetic organic...
Patent
1996-05-06
1998-02-10
Schofer, Joseph L.
Drug, bio-affecting and body treating compositions
Topical body preparation containing solid synthetic organic...
514528, A61K 3174, A61K 7178
Patent
active
057166080
ABSTRACT:
Disclosed are methods for inhibiting acute radiation-induced skin damage during treatment of a patient with ionizing radiation by application of a layer of biocompatible polymer to the skin surface prior to exposure of the surface to ionizing radiation.
REFERENCES:
patent: 3722599 (1973-03-01), Robertson et al.
patent: 4737544 (1988-04-01), McCain et al.
patent: 5254132 (1993-10-01), Barley et al.
patent: 5306490 (1994-04-01), Barley et al.
patent: 5403591 (1995-04-01), Tighe et al.
patent: 5554365 (1996-09-01), Byram et al.
Sitton, Early and Late Radiation-Induced Skin Alterations Part I:Mechanisms of Skin Changes, Oncology Nursing Forum, 19(5):801-807 (1992).
Sitton, Early and Late Radiation-Induced Skin Alterations Part II:Nursing Care of Irradiated Skin, Oncology Nursing Forum, 19(6):907-912 (1992).
Dini, et al., Management of Acute Radiodermatitis, Cancer Nursing, 16(5):366-370 (1993).
Perez, et al., Principles and Practice of Radiation Oncology, Second Edition, J.B. Lippincott Company, Philadelphia, PA, pp. 104-105 (1987).
Rubin et al., Skin and Adnexa, Clinical Radiation and Pathology, Chapter 3, pp. 62-119 (1986).
Barley, Jr. Leonard V.
Byram Michael M.
Goebel Robert
Greff Richard J.
Cheng Wu C.
MedLogic Global Corporation
Schofer Joseph L.
LandOfFree
Methods to inhibit acute radiation-induced skin damage does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods to inhibit acute radiation-induced skin damage, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods to inhibit acute radiation-induced skin damage will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2074966