Methods to couple integrated circuit packages to bonding...

Details Methods to couple integrated circuit packages to bonding... Methods to couple integrated circuit packages to bonding...

2006-05-02

2006-05-02

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Preplacing solid filler

C174S266000, C029S852000

Reexamination Certificate

active

07036712

ABSTRACT:
The electrical contacts of an integrated circuit package are coupled to printed circuit board bonding pads that include vias having via channels. In one embodiment, a method for fabricating an electronic assembly utilizes a mask having at least one aperture that overlies the bonding pad without substantially overlying the bonding pad's via channel. The aperture can be of any shape, including a circle, ellipse, polygon, or a free-form shape. Solder paste is screened through the mask onto the printed circuit board pads but not the via channels. The electrical contacts of a surface mount technology component such as a ball grid array component can then be affixed to the bonding pads using a reflow soldering technique according to one embodiment.

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