Methods of transferring a lamina to a receiver element

Details Methods of transferring a lamina to a receiver element Methods of transferring a lamina to a receiver element

2011-06-28

2011-06-28

Mazumdar, Sonya (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S272200, C438S455000, C438S057000

Reexamination Certificate

active

07967936

ABSTRACT:
Methods for bonding a donor wafer to a receiver element and transferring a lamina from the donor wafer to the receiver element are disclosed herein. The donor wafer may be, for example, a monocrystalline silicon wafer with a thickness of from about 300 microns to about 1000 microns, and the lamina may be may be less than 100 microns thick. The receiver element may be composed of, for example, metal or glass, and the receiver element may have dissimilar thermal expansion properties from the lamina. Although the lamina and the receiver element may have dissimilar thermal expansion properties, the methods disclosed herein maintain the integrity of the bond between the lamina and the receiver element.

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