Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-01-17
2006-01-17
Yao, Sam Chuan (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S291000, C156S324000, C156S209000
Reexamination Certificate
active
06986825
ABSTRACT:
A method of and apparatus for laminating a first material (40) such as a spunbonded polymer having a point emboss pattern (41) formed thereon, to a second material (43) such as a polymer film, involves use of a lamination process using a point lamination pattern (56) provided on a heated calender roll (50). One or more geometric characteristics of two patterns (41, 56) such as bonding/contact area, pitch or angle of axes, is selected and differentiated, prior to lamination, to control, during lamination, the amount of point or mis-registration between the two patterns (41, 56). The laminate (60) can have optimum all over lamination if the amount of point mis-registration is maximized. An adhesive can be provided between the first and second materials (40, 43) to enable lamination of dissimilar composition materials.
REFERENCES:
patent: 4217386 (1980-08-01), Arons et al.
patent: 4260443 (1981-04-01), Lindsay et al.
patent: 4725473 (1988-02-01), Van Gompel et al.
patent: 4761322 (1988-08-01), Raley
patent: 4803032 (1989-02-01), Schulz
patent: 5695868 (1997-12-01), McCormack
patent: 5763041 (1998-06-01), Leak et al.
patent: 6306482 (2001-10-01), Ruppel et al.
patent: 13063/71 (1975-08-01), None
patent: 19 54 801 (1970-11-01), None
patent: 195 34 812 (1997-03-01), None
patent: 196 47 458 (1998-05-01), None
patent: 0 490 476 (1992-06-01), None
patent: 0 604 736 (1994-07-01), None
patent: 1 459 106 (1976-12-01), None
patent: 2 284 384 (1995-06-01), None
patent: 2 290 052 (1995-12-01), None
patent: 5209355 (1993-08-01), None
patent: WO 9720687 (1997-06-01), None
patent: WO 9720688 (1997-06-01), None
Squires Leslie James
Woodbridge Timothy
Dinsmore & Shohl LLP
Hunt Technology Limited
Yao Sam Chuan
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