Methods of strengthening bonds

Details Methods of strengthening bonds Methods of strengthening bonds

1974-12-10

1978-01-10

Weiffenbach, Cameron K.

Coating processes

Electrical product produced

Metal coating

427123, 427124, 427271, 427383A, 427383B, 357 71, B05D 512

Patent

active

040680223

ABSTRACT:
The adherence of thin-film conductors to supporting substrates, and therefore the strength of external lead bonds made to the conductors, is increased by forming the conductors first and then heat treating them in air. The conductors may be formed from layers of titanium, palladium and gold sequentially deposited on the substrate or, in order to reduce the amount of gold, a portion of it may be replaced by copper and nickel.

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patent: 3528893 (1970-09-01), Christie et al.
patent: 3665254 (1972-05-01), Collard et al.
patent: 3686080 (1972-08-01), Banfield et al.
patent: 3708403 (1973-01-01), Koger et al.
patent: 3765970 (1973-10-01), Athanas et al.
patent: 3783056 (1974-01-01), Keller et al.
patent: 3890177 (1975-06-01), Pfahnl et al.

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