Methods of splitting CdZnTe layers from CdZnTe substrates...

Details Methods of splitting CdZnTe layers from CdZnTe substrates... Methods of splitting CdZnTe layers from CdZnTe substrates...

2011-07-05

2011-07-05

Sarkar, Asok K (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C257SE21088, C257SE21567, C257SE21568, C438S455000, C438S456000, C438S457000

Reexamination Certificate

active

07972938

ABSTRACT:
Methods of producing CdZnTe (CZT) layers for the epitaxial growth of HgCdTe thereon include implanting ions into a CZT substrate at a low temperature to form a damaged layer underneath a CZT surface layer, bonding a wafer to the CZT substrate about the CZT surface layer using a bonding material, and, annealing the CZT substrate for a time sufficient to facilitate the splitting of the CZT substrate at the damaged layer from the CZT surface layer.

REFERENCES:
patent: 4072782 (1978-02-01), Kramer et al.
patent: 5399206 (1995-03-01), de Lyon
patent: 5454885 (1995-10-01), Dudoff et al.
patent: 6168967 (2001-01-01), Hoffbauer et al.
patent: 6242324 (2001-06-01), Kub et al.
patent: 6562127 (2003-05-01), Kud et al.
patent: 7041178 (2006-05-01), Tong et al.
patent: 2008/0138611 (2008-06-01), Yasuzawa et al.
S. Stolyarova, N. Amir and Y. Nemirovsky , Rapid thermal processing of epitaxial II-VI heterostructures, Journal of Crystal Growth, vols. 198-199, Part 2, Mar. 1999, pp. 1157-1161.
Tony, Qin-Yi and Gosele, Ulrich M., Wafer Bonding and Layer Splitting for Microsystems; Advanced Materials, vol. II, No. 17, 1999, pp. 409-1425.

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