Methods of securing a thermocouple to a ceramic substrate

Details Methods of securing a thermocouple to a ceramic substrate Methods of securing a thermocouple to a ceramic substrate

2008-01-08

2010-11-16

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

C228S180500, C228S246000, C228S248100

Reexamination Certificate

active

07832616

ABSTRACT:
Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of the thermocouple to the ceramic substrate. In one form, the junction is directly bonded using an active brazing material.

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Machine translation of JP-5-52668A.
Y.H. Chiao et al., “Interfacial Bonding in Brazed and Cofied Aluminum Nitride”, ISHM 91 Proceedings, 1991, pp. 460-468.
International Search Report for PCT/US2007/010157.

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