Methods of removing binder from powder moldings

Details Methods of removing binder from powder moldings Methods of removing binder from powder moldings

1991-12-31

1993-03-16

Derrington, James

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264344, 419 10, 419 36, 419 37, 419 65, C04B 4191

Patent

active

051942038

ABSTRACT:
A method of mixing a powder material and a binder in a predetermined ratio and kneading the mixture so that substantially whole surface of the powder particles are covered by the binder, molding the kneaded mixture into the shapes of desired products, then removing the binder from the moldings without causing expansion or cracks in the moldings before sintering. The binder comprises one or more organic binding substances soluble to an alcohol or to an mixed solvent of an alcohol and benzene or one or more ketones and one or more organic binding substances insoluble to the alcohol or to the mixed solvent. The moldings are put in contact with the alcohol or the mixed solvent to extract the organic binding substances soluble to the alcohol or to the mixed solvent from the moldings. The organic binding substances insoluble to the alcohol or to the mixed solvent are then removed by heat-decomposition. The dissolution of the organic binding substances soluble to the alcohol or to the mixed solvent can be controlled to an appropriate rate by the constituents of the mixed solvent and their ratio of mixture.
By this method, it is made possible to remove the binder from the moldings made of powders with small particle sizes and large specific surface areas, which are difficult to remove the binder from without causing defects by the conventional methods, in short time without causing expansion or cracks in them.

REFERENCES:
patent: 4283360 (1981-08-01), Henmi
patent: 5059388 (1991-10-01), Kihara et al.
The Condensed Chemical Dictionary, Reinhold Pub. Corp., New York, 1961, p. 912.
English Language Abstract of Japanese Patent Application No. 56-108802.
English Language Abstract of Japanese Patent Application No. 2-101101.

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