Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2006-01-17
2008-07-22
Le, Thao X. (Department: 2892)
Semiconductor device manufacturing: process
With measuring or testing
C257SE21521
Reexamination Certificate
active
07402443
ABSTRACT:
A method of providing a family of integrated circuits (ICs) includes applying a first product selection code (PSC) to a first IC die, applying a second PSC to a second IC die, and providing a third packaged IC die. The first IC die includes first and second portions, both of which are operational based on the first PSC. The second IC die is a duplicate of the first die, but the second portion is rendered non-operational by the second PSC. The third IC die is substantially similar to the first portion of the first die. The second and third packages can be the same and the packaged dies can be interchangeable in a system. When the dies are programmable logic device (PLD) dies, the second and third dies use the same configuration bit stream, which may be smaller than the configuration bit stream for the first IC die.
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Bauer Trevor J.
Goetting F. Erich
Pang Raymond C.
Talley Bruce E.
Young Steven P.
Cartier Lois D.
Le Thao X.
Ullah Elias
Xilinx , Inc.
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