Methods of producing printed circuit boards

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29837, H05K 302, H05K 304

Patent

active

049128442

ABSTRACT:
A punch has a planar surface and raised portions extending from the planar surface. First ones of the raised portions may have a height of approximately 3-25 mils. Second ones of the raised portions may have a greater depth than the first raised portions. The punch may be heated and/applied to the planar surface of a substrate which may also be pre-heated and which has properties of becoming deformed when subjected to heat and pressure. The punch produces cavities and grooves in the substrate at the positions of the raised portions. Electrical components may be disposed in the cavities in the substrate and an electrically conductive material may be disposed in the grooves to communicate with the electrical components. The raised portions in the punch may be provided by printed circuit techniques or by matching or by laser techniques. Alternatively, a foil may be disposed on the planar surface of the punch and the raised portions of the punch. When the punch is applied to the substrate, the grooves and cavities are formed and the foil is transferred to the substrate on the planar surface and in the grooves and cavities in the substrate. The portions of the foil on the planar surface of the substrate may then be removed as by printed circuit techniques or machining or laser techniques so that only the portions of the foil in the grooves and the cavities remain. If desired, these portions of the foil may be electrically plated.

REFERENCES:
patent: 2955351 (1960-10-01), McCreadie
patent: 2986804 (1961-06-01), Greenman et al.
patent: 3990142 (1976-11-01), Weglin
patent: 4363930 (1982-12-01), Hoffman
patent: 4374457 (1983-02-01), Wietch, Jr.
patent: 4614837 (1986-09-01), Kane et al.

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