Methods of producing integrated circuit devices

Details Methods of producing integrated circuit devices Methods of producing integrated circuit devices

1996-07-29

2000-09-12

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438 33, 438 38, 438110, 438118, 438460, 438462, 438463, 438464, H01L 2100, H01L 2150, H01L 2144

Patent

active

061177075

ABSTRACT:
A method for producing integrated circuit devices including the steps of producing a plurality of integrated circuits on a wafer, each of the integrated circuits including a multiplicity of pads and thereafter slicing the wafer, thereby to define a plurality of integrated circuit elements, and wherein the step of slicing exposes sectional surfaces of the multiplicity of pads. Apparatus for carrying out the method and integrated circuit devices are also described and claimed.

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