Methods of processing thick ILD layers using spray coating...

Details Methods of processing thick ILD layers using spray coating... Methods of processing thick ILD layers using spray coating...

2005-09-13

2005-09-13

Quach, T. N. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S737000, C257S758000, C257S780000

Reexamination Certificate

active

06943440

ABSTRACT:
A process flow to make an interconnect structure with one or more thick metal layers under Controlled Collapse Chip Connection (C4) bumps at a die or wafer level. The interconnect structure may be used in a backend interconnect of a microprocessor. The process flow may include forming an inter-layer dielectric with spray coating or lamination over a surface with high aspect ratio structures.

REFERENCES:
patent: 5856705 (1999-01-01), Ting
patent: 5950102 (1999-09-01), Lee
patent: 6255675 (2001-07-01), Trimberger
patent: 6341418 (2002-01-01), Brouillette et al.
patent: 6426545 (2002-07-01), Eichelberger et al.
patent: 6495915 (2002-12-01), Hsieh et al.
patent: 6673698 (2004-01-01), Lin et al.
patent: 2001/0023981 (2001-09-01), Ikumo et al.
patent: 2002/0048930 (2002-04-01), Lin
patent: 2003/0111711 (2003-06-01), Lin et al.
patent: 10-228110 (1998-08-01), None
William S. Song, et al., “Power Distribution Techniques for VLSI Circuits”,IEEE Journal of Solid-State Circuits,SC-21(1):150-156, Feb. 1986.
E. Beyne, J. Poormans; “Enabling Technologies for Distributed and Autonomous Electronic Systems, EDAS”; imec 2002 presentation.

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