Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-07-17
2007-07-17
Nguyen, Vinh P. (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S755090
Reexamination Certificate
active
09827248
ABSTRACT:
An electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus are provided. One embodiment of an electronic device workpiece processing apparatus includes a chuck including a surface, an electrical coupling adjacent the surface, and electrical interconnect configured to connect with the electrical coupling of the chuck and conduct signal within the chuck; an intermediate member having a first surface and a second surface and the intermediate member including: and electrical coupling adjacent the first surface and configured to couple with the electrical coupling of the chuck; an electrical coupling adjacent the second surface; and an electrical interconnect configured to connect the electrical coupling adjacent the first surface and the electrical coupling adjacent the second surface; and an electronic device workpiece configured to couple with the second surface of the intermediate member, the electronic device workpiece including a sensor and an electrical coupling configured to provide electrical connection of the sensor with the electrical coupling of the second surface of the intermediate member.
REFERENCES:
patent: 3440407 (1969-04-01), Golstos et al.
patent: 3614345 (1971-10-01), Quinn
patent: 3683306 (1972-08-01), Bulthius et al.
patent: 3710251 (1973-01-01), Hagge et al.
patent: 4006909 (1977-02-01), Ollendorf et al.
patent: 4284872 (1981-08-01), Graeme
patent: 4332081 (1982-06-01), Francis
patent: 4355463 (1982-10-01), Burns
patent: 4356379 (1982-10-01), Graeme
patent: 4518944 (1985-05-01), Faris
patent: 4560216 (1985-12-01), Egawa
patent: 4703555 (1987-11-01), Hubner
patent: 4754555 (1988-07-01), Stillman
patent: 4802099 (1989-01-01), Logue
patent: 4818327 (1989-04-01), Davis et al.
patent: 4888988 (1989-12-01), Lee et al.
patent: 4912600 (1990-03-01), Jaeger et al.
patent: 5141334 (1992-08-01), Castles
patent: 5325052 (1994-06-01), Yamashita
patent: 5347869 (1994-09-01), Shie et al.
patent: 5378311 (1995-01-01), Nagayama et al.
patent: 5406109 (1995-04-01), Whitney
patent: 5435646 (1995-07-01), McArthur et al.
patent: 5436494 (1995-07-01), Moslehi
patent: 5437189 (1995-08-01), Brown et al.
patent: 5446437 (1995-08-01), Bantien et al.
patent: 5475317 (1995-12-01), Smith
patent: 5478242 (1995-12-01), Walker et al.
patent: 5492011 (1996-02-01), Amano et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5503034 (1996-04-01), Amano et al.
patent: 5522215 (1996-06-01), Matsunaga et al.
patent: 5550526 (1996-08-01), Mottahead
patent: 5551283 (1996-09-01), Manaka et al.
patent: 5612574 (1997-03-01), Summerfelt et al.
patent: 5645764 (1997-07-01), Angelopoulos et al.
patent: 5670066 (1997-09-01), Barnes et al.
patent: 5703287 (1997-12-01), Treutler et al.
patent: 5719333 (1998-02-01), Hosoi et al.
patent: 5746513 (1998-05-01), Renken
patent: 5830372 (1998-11-01), Hierold
patent: 5831333 (1998-11-01), Malladi et al.
patent: 5919548 (1999-07-01), Barron et al.
patent: 5945834 (1999-08-01), Nakata et al.
patent: 5964395 (1999-10-01), Glovatsky et al.
patent: 5969639 (1999-10-01), Lauf et al.
patent: 6004471 (1999-12-01), Chuang
patent: 6037645 (2000-03-01), Kreider
patent: 6121061 (2000-09-01), Van Bilsen et al.
patent: 6190040 (2001-02-01), Renken et al.
patent: 6229322 (2001-05-01), Hembree
patent: 6293696 (2001-09-01), Alvis
patent: 6325536 (2001-12-01), Renken et al.
patent: 6377060 (2002-04-01), Burkhart et al.
patent: 6411116 (2002-06-01), DeHaven et al.
patent: 6577148 (2003-06-01), DeHaven et al.
patent: 6635852 (2003-10-01), Seiwa
patent: 6645701 (2003-11-01), Ota et al.
patent: 6709878 (2004-03-01), Akram et al.
patent: 6744346 (2004-06-01), Akram et al.
patent: 6865080 (2005-03-01), Rodosevich et al.
patent: 6936649 (2005-08-01), Forbes et al.
patent: 2336778 (1977-07-01), None
patent: 56-12521 (1981-02-01), None
patent: 2-268462 (1990-11-01), None
patent: 406310580 (1994-11-01), None
Application Guide Temperature Sensors, Warlow Electrical Manufacturing Company Catalog, pp. 775-778, 1992/1993. (month unavailable).
In-Situ survery System of Reserve and Thermoelectric Properties of Either Pure or Mixed Materials in Thin Films Evaporated Under Ultra High Vacuum, Lechevallier, LeHuerou, Richon, Sarran & Gouault, J. Phys. III France, vol. 5, pp. 409-418, 04/95 (Abstract only).
Temperature Metrology for CD Control in DUV Lithography, Jeffrey Parker and Wayne Renken, pp. 111-112, 114, 116, Sep. 17, 1997.
“NTC and PTC Thermistors”; http://www.thermodisc.com
tcptc.html; Jan. 7, 1998; 2 pages.
“DI-5B35 Linearized 4-Wire RTD Input”;http://www.dataq.com/di5b35.html; Jan. 7, 1998; 2 pages.
“RTD”; http://www.misensors.com/rtds.html; Jan. 7, 1998; 3 pages.
“Low Cost Thermal-Ribbon (TM) uses thin film RTD”; http://www.minco.com/s17624nr.html; Jan. 7, 1998; 1 page.
“Silicon Processing for the VLSI Era”; vol. 1—Process Technology, Second Edition; S. Wolf et al.; 2000; ppg 22-25 and pp. 841-845.
Advertisement for Probe Technology; www.idinet.com; Interconnect Devices, Inc., 1 page; Mar. 6, 1998.
Good Things Come In Small BGA/CSP Packages; www.johnstech.com/4handbook/page9.html; 1 page; Mar. 5, 1998.
Product Description for Double Ended Probes, B1052 Series; www.testprobe.com/products/b1052.html; Rika Denshi America, Inc.; 1 page; Feb. 4, 1998.
Product Description for Test Centers, RM-500 Series Probes, www.testprobe.com/products/rm500.html; Rika Denshi America, Inc.; 1 page; Feb. 4, 1998.
Product Description for Cost Effective Interconnections for High I/O Products; www.testprobe.com/products/io.htm#b1303; Rika Denshi America, Inc.; 1 page; Feb. 4, 1998.
Product Description for Ball Grid Probe B1303-C3;www.testprobe.com/products/io.htm#b1303; Rika Denshi America, Inc.; 1 page; Feb. 4, 1998.
Product Description for Test Socket Contacts; www.johnstech.com/4/handbook/page9.html; 1 page; Mar. 5, 1998.
Micro)n Technology, Inc.
Nguyen Vinh P.
Wells St. John P.S.
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