Methods of polishing semiconductor substrates

Details Methods of polishing semiconductor substrates Methods of polishing semiconductor substrates

1995-10-12

1997-05-06

Dang, Thi

Semiconductor device manufacturing: process

Repair or restoration

438693, 438633, H01L 2100, B24B 100

Patent

active

056267150

ABSTRACT:
Methods of polishing, particularly chem-mech polishing a semiconductor substrate to planarize a layer, to remove excess material from atop a layer, and to strip back a defective layer are disclosed. Aluminum oxide particles having a small, well controlled size, and substantially in the alpha phase provide beneficial results when polishing.

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patent: 4944836 (1990-07-01), Beyer et al.
patent: 4956025 (1990-09-01), Okajima et al.
patent: 4956313 (1990-09-01), Cote et al.
patent: 5128081 (1992-07-01), Siegel et al.
patent: 5142828 (1992-09-01), Curry, II

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