Methods of patterning a substrate

Coating processes – Nonuniform coating – Applying superposed diverse coatings or coating a coated base

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C427S256000, C427S258000, C427S058000, C438S758000, C438S765000

Reexamination Certificate

active

07959975

ABSTRACT:
A method of patterning a substrate is disclosed. An ink material is chemisorbed to at least one region of a stamp and the chemisorbed ink material is transferred to a receptor substrate. The ink material has greater chemical affinity for the receptor substrate than for the at least one region of the stamp. A method of forming the stamp is also disclosed, as are the stamp and a patterning system.

REFERENCES:
patent: 4797357 (1989-01-01), Mura et al.
patent: 5512131 (1996-04-01), Kumar et al.
patent: 5580700 (1996-12-01), Rahman
patent: 5620850 (1997-04-01), Bamdad et al.
patent: 5772905 (1998-06-01), Chou
patent: 5879853 (1999-03-01), Azuma
patent: 5948470 (1999-09-01), Harrison et al.
patent: 5958704 (1999-09-01), Starzl et al.
patent: 6207787 (2001-03-01), Fahey et al.
patent: 6309580 (2001-10-01), Chou
patent: 6414164 (2002-07-01), Afzali-Ardakani et al.
patent: 6423474 (2002-07-01), Holscher
patent: 6506660 (2003-01-01), Holmes et al.
patent: 6517933 (2003-02-01), Soane et al.
patent: 6518194 (2003-02-01), Winningham et al.
patent: 6537920 (2003-03-01), Krivokapic
patent: 6565764 (2003-05-01), Hiraoka et al.
patent: 6592764 (2003-07-01), Stucky et al.
patent: 6635912 (2003-10-01), Ohkubo
patent: 6656308 (2003-12-01), Hougham et al.
patent: 6679996 (2004-01-01), Yao
patent: 6780492 (2004-08-01), Hawker et al.
patent: 6812132 (2004-11-01), Ramachandrarao et al.
patent: 6825358 (2004-11-01), Afzali-Ardakani et al.
patent: 6887332 (2005-05-01), Kagan et al.
patent: 6911400 (2005-06-01), Colburn et al.
patent: 6940485 (2005-09-01), Noolandi
patent: 6995439 (2006-02-01), Hill et al.
patent: 7001795 (2006-02-01), Jiang et al.
patent: 7009227 (2006-03-01), Patrick et al.
patent: 7037738 (2006-05-01), Sugiyama et al.
patent: 7045851 (2006-05-01), Black et al.
patent: 7060774 (2006-06-01), Sparrowe et al.
patent: 7087267 (2006-08-01), Breen et al.
patent: 7112617 (2006-09-01), Kim et al.
patent: 7119321 (2006-10-01), Quinlan
patent: 7135241 (2006-11-01), Ferraris et al.
patent: 7151209 (2006-12-01), Empedocles et al.
patent: 7332370 (2008-02-01), Chang et al.
patent: 7347953 (2008-03-01), Black et al.
patent: 2001/0024768 (2001-09-01), Matsuo et al.
patent: 2002/0167117 (2002-11-01), Chou
patent: 2003/0034329 (2003-02-01), Chou
patent: 2003/0068639 (2003-04-01), Haneder et al.
patent: 2003/0080471 (2003-05-01), Chou
patent: 2003/0080472 (2003-05-01), Chou
patent: 2003/0108879 (2003-06-01), Klaerner et al.
patent: 2003/0157248 (2003-08-01), Watkins et al.
patent: 2003/0196748 (2003-10-01), Hougham et al.
patent: 2003/0235930 (2003-12-01), Bao et al.
patent: 2004/0058059 (2004-03-01), Linford et al.
patent: 2004/0124092 (2004-07-01), Black et al.
patent: 2004/0142578 (2004-07-01), Wiesner et al.
patent: 2004/0163758 (2004-08-01), Kagan et al.
patent: 2004/0256615 (2004-12-01), Sirringhaus et al.
patent: 2005/0079486 (2005-04-01), Abbott et al.
patent: 2005/0120902 (2005-06-01), Adams et al.
patent: 2005/0238967 (2005-10-01), Rogers et al.
patent: 2005/0250053 (2005-11-01), Marsh et al.
patent: 2006/0035387 (2006-02-01), Wagner et al.
patent: 2006/0097134 (2006-05-01), Rhodes
patent: 2006/0128165 (2006-06-01), Theiss et al.
patent: 2006/0134556 (2006-06-01), Nealey et al.
patent: 2006/0137554 (2006-06-01), Kron et al.
patent: 2006/0141245 (2006-06-01), Stellacci et al.
patent: 2006/0163646 (2006-07-01), Black et al.
patent: 2006/0231525 (2006-10-01), Asakawa et al.
patent: 2006/0249784 (2006-11-01), Black et al.
patent: 2007/0045642 (2007-03-01), Li
patent: 2007/0122749 (2007-05-01), Fu et al.
patent: 2007/0181870 (2007-08-01), Libertino et al.
patent: 2007/0183035 (2007-08-01), Asakawa et al.
patent: 2007/0281220 (2007-12-01), Sandhu et al.
patent: 2008/0038923 (2008-02-01), Edelstein et al.
patent: 2008/0041818 (2008-02-01), Kihara et al.
patent: 2008/0047930 (2008-02-01), Blanchet et al.
patent: 2008/0064217 (2008-03-01), Horii
patent: 2008/0073743 (2008-03-01), Alizadeh et al.
patent: 2008/0083991 (2008-04-01), Yang et al.
patent: 2008/0093743 (2008-04-01), Yang et al.
patent: 2008/0102252 (2008-05-01), Black et al.
patent: 2008/0103256 (2008-05-01), Kim et al.
patent: 2008/0113169 (2008-05-01), Cha et al.
patent: 1906237 (2008-02-01), None
patent: 2005029779 (2005-03-01), None
patent: 2006110434 (2006-04-01), None
patent: 2007-194175 (2007-08-01), None
patent: 10-2006-0128378 (2006-12-01), None
patent: 02-18080 (2002-03-01), None
patent: 03045840 (2003-06-01), None
patent: 2006003592 (2006-01-01), None
patent: 2006003594 (2006-01-01), None
patent: WO 2006/003592 (2006-01-01), None
patent: 2006112887 (2006-10-01), None
patent: 2008055137 (2008-05-01), None
Kuhnline et al., “Detecting thiols in a microchip device using micromolded carbon ink electrodes modified with cobalt phthalocyanine”, Analyst, vol. 131, pp. 202-207, (2006).
Sang et al., “Epitaxial self-assembly of block copolymers on lithographically defined nanopatterned substrates”, Nature, vol. 24, pp. 411-414, (Jul. 2003).
Clark et al., “Selective Deposition in Multilayer Assembly: SAMs as Molecular Templates”, Supramolecular Science, vol. 4, pp. 141-146, (1997).
Gates, “Nanofabrication with Molds and Stamps”, Materials Today, pp. 44-49, (Feb. 2005).
Ji et al., Molecular Transfer Printing Using Block Copolymers, ACS Nano, vol. 4, No. 2, pp. 599-609, 2010.
Yu et al., Contact Printing Beyond Surface Roughness: Liquid Supramolecular Nanostamping, Advanced Materials, vol. 19, 2007, pp. 4338-4342.
Black, Charles T., et al., “Nanometer-Scale Pattern Registration and Alignment by Directed Diblock Copolymer Self-Assembly,” IEEE Transactions on Nanotechnology, vol. 3, No. 3, pp. 412-415, Sep. 2004.
Black, C.T., “Self-aligned self-assembly of multi-nanowire silicon field effect transistors,” Appl. Phys. Lett., vol. 87, pp. 163116-1 through 163116-3, 2005.
Erlandsson, Mikael, et al., “Metallic Zinc Reduction of Disulfide Bonds between Cysteine Residues in Peptides and Proteins,” International Journal of Peptide Research and Therapeutics, vol. 11, No. 4, pp. 261-265, Dec. 2005.
Guarini, K.W., et al., “Nanoscale patterning using self-assembled polymers for semiconductor applications,” J. Vac. Sci. Technol. B, vol. 19, No. 6, pp. 2784-2788, Nov./Dec. 2001.
Hamers, Robert J., “Passivation and activation: How do monovalent atoms modify the reactivity of silicon surfaces? A perspective on the article, ‘The mechanism of amine formation on Si(100) activated with chlorine atoms,’” Surface Science, vol. 600, pp. 3361-3362, 2006.
Jiang, Xingyu, et al., “Electrochemical Desorption of Self-Assembled Monolayers Noninvasively Releases Patterned Cells from Geometrical Confinements,” J. Am. Chem. Soc., vol. 125, No. 9, pp. 2366-2367, 2003.
Johnson, Daniel L., et al., “Probing the stability of the disulfide radical intermediate of thioredoxin using direct electrochemistry,” Letters in Peptide Science, vol. 10, pp. 495-500, 2003.
Jun, Yongseok, et al., “Microcontact Printing Directly on the Silicon Surface,” Langmuir, vol. 18, No. 9, pp. 3415-3417, 2002.
Jun, Yongseok, et al., “Patterning protein molecules on poly(ethylene glycol) coated Si(111),” Biomaterials, vol. 25, pp. 3503-3509, 2004.
Li, Yong, et al., “A Method for Patterning Multiple Types of Cells by Using Electrochemical Desorption of Self-Assembled Monolayers within Microfluidic Channels,” Angew. Chem. Int. Ed., vol. 46, pp. 1094-1096, 2007.
Lutz, Jean-Francois, “1,3-Dipolar Cycloadditions of Azides and Alkynes: A Universal Ligation Tool in Polymer and Materials Science,” Angew. Chem. Int. Ed., vol. 46, pp. 1018-1025, 2007.
Niu, Sanjun, et al., “Selective assembly of nanoparticles on block copolymer by surface modification,” Nanotechnology, vol. 18, pp. 1-4, 2007.
Park, Sang-Min, et al., “Directed assembly of lamellae-forming block copolymers using chemically and topographically patterned substrates,” 16 pages, no date.
Reed, M.A., et al.,

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Methods of patterning a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of patterning a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of patterning a substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2699744

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.