Electricity: conductors and insulators – Anti-inductive structures – Shielded
Reexamination Certificate
2011-06-28
2011-06-28
Lam, Cathy (Department: 1784)
Electricity: conductors and insulators
Anti-inductive structures
Shielded
C174S250000, C174S389000, C427S098100, C427S301000, C427S305000, C427S306000, C427S404000, C430S307000, C430S314000, C430S315000
Reexamination Certificate
active
07968804
ABSTRACT:
An article includes a polymeric film having a major surface, a discontinuous layer of a catalytic material on the major surface, and a metal pattern on the catalytic material. The discontinuous layer of catalytic material has an average thickness of less than 200 angstroms. Methods of forming these articles are also disclosed.
REFERENCES:
patent: 2963748 (1960-12-01), Young
patent: 3075280 (1963-01-01), Jack
patent: 3620933 (1971-11-01), Grunwald et al.
patent: 3800020 (1974-03-01), Parfet
patent: 3891514 (1975-06-01), Klemm
patent: 3952152 (1976-04-01), Lill et al.
patent: 4179797 (1979-12-01), Johnson
patent: 4321296 (1982-03-01), Rougier
patent: 4381421 (1983-04-01), Coats et al.
patent: 4412255 (1983-10-01), Kuhlman et al.
patent: 4510347 (1985-04-01), Wiech, Jr.
patent: 4552615 (1985-11-01), Amendola et al.
patent: 4576850 (1986-03-01), Martens
patent: 4614837 (1986-09-01), Kane et al.
patent: 4748130 (1988-05-01), Wenham et al.
patent: 4775611 (1988-10-01), Sullivan
patent: 4869930 (1989-09-01), Clarke et al.
patent: 4915780 (1990-04-01), Beckett
patent: 5061438 (1991-10-01), Lillie et al.
patent: 5094811 (1992-03-01), Kane et al.
patent: 5399879 (1995-03-01), Liu
patent: 5462624 (1995-10-01), Kwon
patent: 5512131 (1996-04-01), Kumar
patent: 5595943 (1997-01-01), Itabashi et al.
patent: 5900160 (1999-05-01), Whitesides
patent: 5932150 (1999-08-01), Lacey
patent: 6048623 (2000-04-01), Everhart
patent: 6121150 (2000-09-01), Avanzino et al.
patent: 6180239 (2001-01-01), Whitesides
patent: 6433481 (2002-08-01), Marutsuka
patent: 6518168 (2003-02-01), Clem
patent: 6582767 (2003-06-01), Fukushima et al.
patent: 6599824 (2003-07-01), Krivokapic
patent: 6737170 (2004-05-01), Fitch et al.
patent: 6776094 (2004-08-01), Whitesides
patent: 6788463 (2004-09-01), Merrill et al.
patent: 6828581 (2004-12-01), Zangmeister et al.
patent: 6875475 (2005-04-01), Moran et al.
patent: 6911385 (2005-06-01), Haubrich et al.
patent: 7001658 (2006-02-01), Bourdelais et al.
patent: 7041232 (2006-05-01), Bietsch et al.
patent: 7160583 (2007-01-01), Frey
patent: 7244669 (2007-07-01), Sirringhaus et al.
patent: 7299547 (2007-11-01), Choi et al.
patent: 7442316 (2008-10-01), Jeong et al.
patent: 7582509 (2009-09-01), Li et al.
patent: 7585424 (2009-09-01), Mei
patent: 2007/0036951 (2007-02-01), Nguyen et al.
patent: 2007/0049130 (2007-03-01), Kojima et al.
patent: 2007/0095469 (2007-05-01), Burdinski
patent: 2008/0095988 (2008-04-01), Frey et al.
patent: 2008/0182079 (2008-07-01), Mirkin et al.
patent: 3832299 (1990-03-01), None
patent: 2247784 (1992-03-01), None
patent: 2381274 (2003-04-01), None
patent: WO 97/34025 (1997-09-01), None
patent: WO 00/79023 (2000-12-01), None
patent: WO 03/049176 (2003-06-01), None
patent: WO 2004/055919 (2004-07-01), None
patent: WO 2004/055920 (2004-07-01), None
patent: WO 2006/062575 (2006-06-01), None
U.S. Appl. No. 11/550,542, filed Oct. 18, 2006; Titled:Methods of Patterning a Material on Polymeric Substrates.
U.S. Appl. No. 11/550,626, filed Oct. 18, 2006; Titled:Methods of Patterning a Deposit Metal on a Polymeric Substrate.
Sard, R., “The Nucleation, Growth, and Structure of Electroless Copper Deposits”,Journal of the Electrochemical Society, vol. 117, No. 7, pp. 864-870 (1970).
V. Svorcik, at al., “Characterization of Evaporated and Sputtered Thin Au Layers on Poly-ethylene terephtalate),” Journal of Applied Polymer Science, 99 1698-1704 (2006).
M. Geissler, at al., Direct Patterning of NiB on Glass Substrates Using Microcontact Printing and Electroless Deposition, Langmuir, vol. 19, No. 15, pp. 6283-6296, 2003.
N. Jeon, at al., “Patterned Self-Assembled Monolayers Formed by Microcontact Printing Direct Selective Metalization by Chemical Vapor Deposition on Planar and Nonplanar Substrates,” Langmuir, vol. 11, No. 8, pp. 3024-3026, 1995.
B. Michel, et al., “Printing Meets Lithography: Soft Approaches to High-Resolution Patterning,” IBM Journal of Research and Development, vol. 45, No. 5, pp. 697-719 (2001).
A. Ulman, “Formation and Structure of Self-Assembled Monolayers,” Chem. Rev. 96 1533-1554 (1996).
Pellerite et al. (M.J. Pellerite, T.D. Dunbar, L.D. Boardman, and E.J. Wood, “Effects of Fluorination on Self-Assembled Monolayer Formation from Alkanephosphonic Acids on Aluminum: Kinetics and Structure,” Journal of Physical Chemistry B 107 11726-11736 (2003).
Carcia et al., 2005,Journal of the SID13(7):547-554 “Oxide engineering of ZnO thin-film transistors for flexible electronics”.
Berniard Tracie J.
Boehmer Roxanne A.
Frey Matthew H.
3M Innovative Properties Company
Allen Gregory D.
Lam Cathy
LandOfFree
Methods of patterning a deposit metal on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of patterning a deposit metal on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of patterning a deposit metal on a substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2685806