Methods of packaging an electronic device

Details Methods of packaging an electronic device Methods of packaging an electronic device

1982-05-07

1984-04-03

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29576S, 29588, 228180A, H05K 334

Patent

active

044399189

ABSTRACT:
An electronic device assembly (11) includes a heat dissipating substrate (18) having a seat (16). A device (14) is uniformly spaced from a base surface of the seat (16), and a layer of solder of uniform thickness occupies a gap between the surface of the seat and the device. Leads (31) and (33) extend at a shallow, acute angle from the device. A lead (32) is mounted to a support (28) extending from the substrate (18). Inner portions of the leads (31, 32, 33), the device (14) and portions of the substrate (18), are encased by an envelope (22), while outer portions (67) of the leads and a mounting tab (19) of the substrate extend from the envelope.

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