Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-05-02
2006-05-02
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S832000, C228S180100, C228S180210, C228S180220
Reexamination Certificate
active
07036217
ABSTRACT:
According to a method of mounting electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads. To minimize various defects encountered during solder reflow, while concurrently minimizing PCB area and manufacturing costs, the via pads are formed so that the via holes substantially avoid underlying the solder fillets coupling the component contacts to the PCB bonding pads. In one embodiment, the via pads are formed in the inter-pad space beneath the component; in another embodiment they are offset from the bonding pads. A substrate, an electronic assembly, and an electronic system are also described.
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McCormick Carolyn R.
Mershon Jayne L.
Pearson Tom E.
Arbes Carl J.
Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
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