Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2009-03-17
2010-12-28
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C029S852000, C174S255000, C361S792000
Reexamination Certificate
active
07856706
ABSTRACT:
A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.
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Dreyer Monte
Kumar Raj
Taylor Michael J.
Angwin David P
Banks Derris H
Christie Parker & Hale LLP
Dynamic Details, Inc.
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