Methods of manufacturing power supply distribution structures fo

Metal working – Method of mechanical manufacture – Electrical device making

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174255, 361774, H05K 334

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active

057652791

ABSTRACT:
A power distribution structure for a multichip module and a method for fabricating the same are shown. According to the method of the present invention, a base plate is provided, a plurality of mesas arranged in a pattern are formed on the base plate, the mesas having electrically conductive upper surfaces which lie substantially in a single plane. A thin, conformal dielectric layer is then formed over the exposed surfaces of the mesas and the support base and a conductive material is deposited over the dielectric material filling the area between and surrounding the mesas. The resulting structure is then planarized, as by polishing, such that the upper surfaces of the mesas and the upper surface of the conductive material surrounding the mesas lie in substantially one plane and are electrically isolated from each other by the dielectric material. A multilayered thin film structure for a multichip module may then be formed over the power distribution structure and power and ground potentials supplied to microelectronic components, such as integrated circuit chips, mounted on the surface of the thin film structure using vias routed through the thin film structure.

REFERENCES:
patent: 4002542 (1977-01-01), Young
patent: 4237522 (1980-12-01), Thompson
patent: 4295183 (1981-10-01), Miersch et al.
patent: 4467450 (1984-08-01), Kuo
patent: 4673904 (1987-06-01), Landis
patent: 4675717 (1987-06-01), Herrero et al.
patent: 4714952 (1987-12-01), Takekawa et al.
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4827323 (1989-05-01), Tigelaar et al.
patent: 4853491 (1989-08-01), Butt
patent: 4889962 (1989-12-01), Hagner
patent: 5079069 (1992-01-01), Howard et al.
patent: 5134539 (1992-07-01), Tuckerman et al.
patent: 5141603 (1992-08-01), Dickey et al.
patent: 5177594 (1993-01-01), Chance et al.
Early, "A Series of Demonstrators to Assess Technologies for Silicon Hybrid Multichip Modules," Proceedings of the 39th Electronics Components Conference, (ECC) 1989, pp. 557-561.
Johnson, "Multichip modules: next-generation packages," IEEE Spectrum, Mar., 1990, pp. 34-36, 46, 48.

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