Methods of manufacturing multilayer interconnections for integra

Details Methods of manufacturing multilayer interconnections for integra Methods of manufacturing multilayer interconnections for integra

1973-08-21

1976-07-06

Clay, Darrell L.

Metal working

Method of mechanical manufacture

Electrical device making

29590, 174 685, 317101A, H01L 2188

Patent

active

039673715

ABSTRACT:
A method of manufacturing multilayer interconnections for interconnecting veral mutually insulated groups of contact zones formed on an integrated circuit semiconductor chip is provided.
The adjacent superimposed interconnection films are separated by an insulating film of a metal oxide produced by the total oxidation of a metal film deposited on the chip prior to the formation of the top layer of interconnections. The metal deposited at the locations of the contact zones is protected against oxidation so that the contact zones are all times accessible at the surface.

REFERENCES:
patent: 3461347 (1969-08-01), Lemelson

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