Methods of manufacturing and testing bonding wires

Details Methods of manufacturing and testing bonding wires Methods of manufacturing and testing bonding wires

2007-09-04

2007-09-04

Chang, Richard (Department: 3726)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S832000, C029S846000, C029S840000, C324S525000

Reexamination Certificate

active

10337153

ABSTRACT:
A method of making and testing an electronic device that includes providing first and second external pins, first and second pads on the substrate connected to the first external pin by respective bonding wires, and third and fourth pads on the substrate connected to the second external pin respective bonding wires, and to a first common line by respective resistors. With a circuit configuration of this type, the intactness of the bonding wires can easily be checked by carrying out a simple resistance measurement between the first and the second external pin.

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