Methods of making thermistor chips

Details Methods of making thermistor chips Methods of making thermistor chips

1999-05-04

2000-08-08

Picardat, Kevin M.

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Thermally responsive

438 55, 438381, H01L 2100

Patent

active

061001104

ABSTRACT:
A thermistor chip is made by first forming first metal layers with a three-layer structure at both end parts of a thermistor block and then forming second metal layers with a three-layer structure on the first metal layers so as to have edge parts that are formed directly in contact with a surface area of the thermistor block and will reduce its normal temperature resistance value. The first and second metal layers are each of a three-layer structure with a lower layer made of a metal with resistance against soldering heat, a middle layer made of a metal with both wettability to solder and resistance against soldering heat, and an upper layer made of a metal having wettability to solder.

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patent: 5493266 (1996-02-01), Sasaki et al.
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patent: 5963416 (1999-10-01), Honda et al.
patent: 6023403 (2000-02-01), McGuire et al.

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