Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-06-29
1997-09-02
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
29832, 174252, 361719, H05K 334
Patent
active
056619022
ABSTRACT:
A method of making a printed circuit board and heat sink structure by initially providing the board with a heat conductive layer oh each of its two sides, the two conductive layers thermally interconnected by heat conductive material extending through holes in the board. An electronic component is mounted spaced apart from the conductive layer on one side of the board and is thermally connected to that layer by a thermally conductive viscous substance injected through a hole from the other side of the board. The viscous material flows in a reverse direction through other holes in the board. A heat sink is then attached by thermally conductive material to the conductive layer on the other side of the board. A method is also included of injecting a thermally conductive curable resin between an electronic component and a printed circuit board with a release agent between the component and the resin. After cooling the resin at sufficiently high temperature for it to be in contact with the release agent, the cured resin cools and shrinks away from the component. Subsequent heating of the resin expands it into heat conductive engagement with the component for quicker release of heat therefrom.
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Austin R. J.
Nguyen Khan V.
Northern Telecom Limited
Vo Peter
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