Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2007-10-02
2007-10-02
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C257SE21499
Reexamination Certificate
active
11289743
ABSTRACT:
A method of making a microelectronic assembly includes providing a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; providing a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface, forming a plurality of conductive elastomeric posts that connect at least some of the contacts of the first microelectronic element to at least some of the contacts of the second microelectronic element, and injecting a compliant material between the first surface of the first microelectronic element and the top surface of the second microelectronic element to form a compliant layer.
REFERENCES:
patent: 4001870 (1977-01-01), Saiki et al.
patent: 4179802 (1979-12-01), Joshi et al.
patent: 4365264 (1982-12-01), Mukai et al.
patent: 4538105 (1985-08-01), Ausschnitt
patent: 4618878 (1986-10-01), Aoyama et al.
patent: 4642889 (1987-02-01), Grabbe
patent: 4648179 (1987-03-01), Bhattacharyya et al.
patent: 4695870 (1987-09-01), Patraw
patent: 4707657 (1987-11-01), Boegh-Petersen
patent: 4716049 (1987-12-01), Patraw
patent: 4783722 (1988-11-01), Osaki et al.
patent: 4792532 (1988-12-01), Ohtani et al.
patent: 4813129 (1989-03-01), Karnezos
patent: 4827376 (1989-05-01), Voss
patent: 4897918 (1990-02-01), Osaka et al.
patent: 4902606 (1990-02-01), Patraw
patent: 4926051 (1990-05-01), Turnbull
patent: 4935584 (1990-06-01), Boggs
patent: 4955523 (1990-09-01), Carlommagno et al.
patent: 4970780 (1990-11-01), Suda et al.
patent: 4994735 (1991-02-01), Leedy
patent: 5020219 (1991-06-01), Leedy
patent: 5065227 (1991-11-01), Frankeny et al.
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5072520 (1991-12-01), Nelson
patent: 5074947 (1991-12-01), Estes et al.
patent: 5086558 (1992-02-01), Grube et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5135890 (1992-08-01), Temple et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5153507 (1992-10-01), Fong et al.
patent: 5180311 (1993-01-01), Schreiber et al.
patent: 5183711 (1993-02-01), Wada et al.
patent: 5196371 (1993-03-01), Gkuleza et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5224265 (1993-07-01), Dux et al.
patent: 5237130 (1993-08-01), Kuleza et al.
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5258648 (1993-11-01), Lin
patent: 5282312 (1994-02-01), DeStefano et al.
patent: 5284796 (1994-02-01), Nakanishi
patent: 5321583 (1994-06-01), McMahon
patent: 5329423 (1994-07-01), Schotz
patent: 5336547 (1994-08-01), Kawakita et al.
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5347159 (1994-09-01), Khandros et al.
patent: 5352318 (1994-10-01), Takabayashi et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5381599 (1995-01-01), Hall
patent: 5384955 (1995-01-01), Booth et al.
patent: 5386627 (1995-02-01), Booth et al.
patent: 5393697 (1995-02-01), Chang et al.
patent: 5404044 (1995-04-01), Booth et al.
patent: 5414298 (1995-05-01), Grube et al.
patent: 5430329 (1995-07-01), Harada et al.
patent: 5431328 (1995-07-01), Chang et al.
patent: 5434452 (1995-07-01), Higgins, III
patent: 5440241 (1995-08-01), King et al.
patent: 5455390 (1995-10-01), DiStefano et al.
patent: 5474458 (1995-12-01), Vafi et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5477160 (1995-12-01), Love
patent: 5492863 (1996-02-01), Higgins, III
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5508228 (1996-04-01), Nolan et al.
patent: 5518964 (1996-05-01), DeStefano et al.
patent: 5535526 (1996-07-01), White
patent: 5550407 (1996-08-01), Ogashiwa
patent: 5578527 (1996-11-01), Chang et al.
patent: 5604380 (1997-02-01), Nishimura et al.
patent: 5627405 (1997-05-01), Chillara
patent: 5629566 (1997-05-01), Doj et al.
patent: 5636104 (1997-06-01), Oh
patent: 5637920 (1997-06-01), Loo
patent: 5639989 (1997-06-01), Higgins, III
patent: 5650919 (1997-07-01), Loh et al.
patent: 5651179 (1997-07-01), Bessho et al.
patent: 5657206 (1997-08-01), Pedersen et al.
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5661088 (1997-08-01), Tessier et al.
patent: 5666270 (1997-09-01), Matsuda et al.
patent: 5677576 (1997-10-01), Akagawa
patent: 5678301 (1997-10-01), Gochnour et al.
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5691041 (1997-11-01), Frankeny et al.
patent: 5729897 (1998-03-01), Schmidt et al.
patent: 5747101 (1998-05-01), Booth et al.
patent: 5749997 (1998-05-01), Tang et al.
patent: 5759737 (1998-06-01), Feilchenfeld et al.
patent: 5770891 (1998-06-01), Frankeny et al.
patent: 5789278 (1998-08-01), Akram et al.
patent: 5790728 (1998-08-01), Wentworth
patent: 5808874 (1998-09-01), Smith
patent: 5813870 (1998-09-01), Gaynes et al.
patent: 5834339 (1998-11-01), Distefano et al.
patent: 5842273 (1998-12-01), Schar
patent: 5846853 (1998-12-01), Otsuki et al.
patent: 5854514 (1998-12-01), Roldan et al.
patent: 5858806 (1999-01-01), Nishida
patent: 5866044 (1999-02-01), Saraf et al.
patent: 5877559 (1999-03-01), Takayama et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 5994781 (1999-11-01), Smith
patent: 6015082 (2000-01-01), Kivilahti
patent: 6020220 (2000-02-01), Gilleo et al.
patent: 6174606 (2001-01-01), Brusic et al.
patent: 6197222 (2001-03-01), Saraf et al.
patent: 6252301 (2001-06-01), Gilleo et al.
patent: 6417029 (2002-07-01), Fjelstad
patent: 6717422 (2004-04-01), Akram
patent: 3127120 (1983-01-01), None
patent: 469614 (1992-03-01), None
patent: 0 708 582 (1995-09-01), None
patent: 58-138058 (1983-08-01), None
patent: 59-148345 (1984-08-01), None
patent: 59-154035 (1984-09-01), None
patent: 62-245640 (1987-10-01), None
patent: 04091448 (1992-03-01), None
patent: 2002-151170 (2002-05-01), None
Coleman W. David
Lerner David Littenberg Krumholz & Mentlik LLP
Tessera Inc.
LandOfFree
Methods of making microelectronic packages with conductive... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of making microelectronic packages with conductive..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of making microelectronic packages with conductive... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3852699