Methods of making microelectronic assemblies

Details Methods of making microelectronic assemblies Methods of making microelectronic assemblies

1998-02-06

1999-03-23

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438109, 438119, 438615, 438654, H01L 21283, H01L 2158, H01L 2160

Patent

active

058858490

ABSTRACT:
A method of making a microelectronic assembly includes providing a starting subassembly having a microelectronic component with a top surface and having electrical contacts, the subassembly further including a plurality of terminals over the top surface of the component, each terminal being connected to at least one contact of the component but moveable with respect to the component; positioning a plurality of joining units each having a solid core on the terminal; providing a unit bonding material at interfaces between each core terminal; and bonding the joining units to the terminals by heating the joining units and terminals so as to convert the unit bonding material to a liquid phase without melting the cores and solidifying the unit bonding material.

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