Methods of making integrated circuits

Details Methods of making integrated circuits Methods of making integrated circuits

2007-09-18

2007-09-18

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000

Reexamination Certificate

active

11142077

ABSTRACT:
A semiconductor device is provided that includes a leadframe, a die, and a clip. The leadframe has a flag and a power pad. The die is coupled to the flag. The clip comprises a die retaining section and a pad section. The die is coupled to the die retaining section, and the pad section extends from the die retaining section. The pad section is coupled to the power pad. Methods for forming the semiconductor device are provided as well.

REFERENCES:
patent: 5544412 (1996-08-01), Romero et al.
patent: 6777800 (2004-08-01), Madrid et al.
patent: 2005/0012183 (2005-01-01), Chow et al.

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