Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1981-08-27
1984-05-01
Ozaki, G.
Metal working
Method of mechanical manufacture
Assembling or joining
29580, 148171, H01L 21368, H01L 2128
Patent
active
044452691
ABSTRACT:
An array of semiconductive photoconductor detectors is formed on a substr with which the array forms a heterojunction. The array has a whole or partial overlayer of the same material as the substrate. Ohmic connections are made on the detectors and conductive read-out leads are connected to these connections; the leads are made of a conductor that forms a Schottky barrier with the substrate and overlayer. Ohmic connections are made to the substrate and overlayer such that a voltage bias may be applied between the substrate-overlayer combination and the array. The bais is used to control the accumulation layer in the substrate beneath the array in order to maximize sesitivity.
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Dunn Aubrey J.
Lane Anthony T.
Lee Milton W.
Ozaki G.
The United States of America as represented by the Scretary of t
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