Methods of making connections to a microelectronic unit

Metal working – Method of mechanical manufacture – Electrical device making

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29841, 29830, 29876, 439 66, 439 91, 22818022, K05K 334

Patent

active

060445483

ABSTRACT:
A method of making connections to a microelectronic unit includes the steps of providing a connection component having a flexible dielectric top sheet, a plurality of terminals on the top sheet and a plurality of electrically conductive, elongated flexible leads connected to the terminals and extending side-by-side downwardly from the terminals away from the top sheet to bottom ends remote from the top sheet. The connection component is then engaged with a front surface of a microelectronic unit having an array of contacts thereon while subjecting the connection component and the microelectronic unit to heat and pressure so that bottom ends of the leads remote from the top sheet bond with the contacts on the microelectronic unit to form electrical connections therewith.

REFERENCES:
patent: 3373481 (1968-03-01), Lins et al.
patent: 4566184 (1986-01-01), Higgin et al.
patent: 4581680 (1986-04-01), Garner
patent: 4764848 (1988-08-01), Simpson
patent: 4871317 (1989-10-01), Jones
patent: 4955523 (1990-09-01), Calomagno et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5414298 (1995-05-01), Grube et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5476211 (1995-12-01), Khandros
patent: 5519936 (1996-05-01), Andros et al.
patent: 5525545 (1996-06-01), Grube et al.
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5794330 (1998-08-01), Distefano et al.
patent: 5801441 (1998-09-01), Distefano et al.
patent: 5805426 (1998-09-01), Merritt et al.
patent: 5808875 (1998-09-01), McMahon et al.
patent: 5893765 (1999-04-01), Farnworth

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