Methods of making composite conductive structures in integrated

Metal treatment – Compositions – Heat treating

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427 88, 427 91, 427 93, 357 67, 357 71, H01L 21283

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042279445

ABSTRACT:
A method of making a composite conductive structure is described. The structure includes an insulating substrate on which is provided a conductor of a refractory metal substantially nonreactive with silicon dioxide covered by a layer of a silicide of the refractory metal and a layer of silicon dioxide. The method includes depositing a layer of polycrystalline silicon over the conductor and the insulating substrate, reacting the layer of polycrystalline silicon with the conductor to form a refractory metal silicide, removing the unreacted portion of the layer of polycrystalline silicon, and then oxidizing the exposed surface of the refractory metal silicide into a layer of silicon dioxide.

REFERENCES:
patent: 3375418 (1968-03-01), Garnache et al.
patent: 4109372 (1978-08-01), Geffken
patent: 4128670 (1978-12-01), Gaensslen

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