Etching a substrate: processes – Forming or treating article containing magnetically...
Reexamination Certificate
2006-07-04
2006-07-04
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Forming or treating article containing magnetically...
C216S041000, C427S132000, C427S282000, C029S603180, C360S322000
Reexamination Certificate
active
07070697
ABSTRACT:
In one illustrative example, a method of making a read sensor of a magnetic head involves forming a barrier structure which surrounds a central mask formed over a plurality of read sensor layers; etching the read sensor layers to form the read sensor below the mask; and depositing, with use of the mask and the barrier structure, hard bias and lead layers to form around the read sensor. The barrier structure may be formed by, for example, depositing one or more barrier structure layers over the read sensor layers and performing a photolithography process. The barrier structure physically blocks materials being deposited at relatively low angles (e.g. angles at or below 71 degrees) so as to reduce their formation far underneath the mask (e.g. when using a bridged mask), which could otherwise form an electrical short, and/or to improve the symmetry of the deposited materials around the read sensor.
REFERENCES:
patent: 3576670 (1971-04-01), Hammond
patent: 4705359 (1987-11-01), Amstutz et al.
patent: 5024896 (1991-06-01), Mathad et al.
patent: 5529670 (1996-06-01), Ryan et al.
patent: 5705042 (1998-01-01), Leiphart et al.
patent: 5746634 (1998-05-01), Jankowski et al.
patent: 5785763 (1998-07-01), Onda et al.
patent: 5885425 (1999-03-01), Hsieh et al.
patent: 6162495 (2000-12-01), Morton
patent: 6168832 (2001-01-01), Boucher
patent: 6202591 (2001-03-01), Witzman et al.
patent: 6209193 (2001-04-01), Hsiao
patent: 2001/0005553 (2001-06-01), Witzman et al.
patent: 2001/0011524 (2001-08-01), Witzman et al.
patent: 2001/0021455 (2001-09-01), Witzman et al.
patent: 2002/0101690 (2002-08-01), Gill et al.
patent: 01-222045 (1989-05-01), None
patent: WO 0008228 (2000-02-01), None
Michael Kautzky et al., “The Application of Collimated Sputtering to Abutted Junction Reader Processing”, Datatech publication, Seagate Technology of Minneapolis, MN, U.S.A., pp. 112-117.
E. C. Fredericks et al., “Novel Linear Evaporator For VLSI Thin Films”, IBM Technical Disclosure Bulletin (TDB), Jun. 1985, vol. 28, No. 1, pp. 184-186.
N. Carlier, “Use of Standard Size Evaporators For Small Angle Metal Deposition On Large Wafers”, IBM Technical Disclosure Bulletin (TDB), Jan. 1991, vol. 33, No. 8, pp. 198-199.
J. P. Hoekstra, ‘Apparatus To Obtain Optimum Control On Metal Vapor Deposition’, IBM Technical Disclosure Bulletin (TDB), Mar. 1972, vol. 14, No. 10, pp. 3043-3044.
Freitag James Mac
Lee Kim Yang
Pinarbasi Mustafa
Wang Chun-Ming Albert
Ahmed Shamim
Hitachi Global Storage Technologies - Netherlands B.V.
Oskorep, Esq. John J.
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