Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-04-01
2008-04-01
Kim, Paul D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S603130, C029S603150, C029S603180, C216S065000, C360S122000, C360S125330, C360S317000, C427S127000, C427S128000, C451S005000, C451S041000
Reexamination Certificate
active
07350284
ABSTRACT:
In one particular example, a plurality of CPP type sensor layers are formed over a wafer and a mask without undercuts is formed over the plurality of CPP type sensor layers in a central region. With the mask without undercuts in place, an ion milling process is started to remove CPP type sensor layer materials left exposed by the mask without undercuts in end regions which surround the central region. The ion milling process is stopped at or near a spacer layer of the CPP type sensor layers. Insulator materials are then deposited in the end regions where the CPP type sensor layer materials were removed, followed by hard bias materials over the insulator materials. The mask without undercuts is then removed through use of a chemical-mechanical polishing (CMP) assisted lift-off process, which also planarizes the top surface.
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Hitachi Global Storage Technologies - Netherlands B.V.
Kim Paul D.
Oskorep, Esq. John J.
Zises Matthew
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