Metal fusion bonding – Process – Diffusion type
Patent
1990-09-04
1992-04-21
Heinrich, Samuel M.
Metal fusion bonding
Process
Diffusion type
228124, 228231, B23K 3100
Patent
active
051060094
ABSTRACT:
A method of joining components by soldering comprising forming discrete layers of silver (13, 17) and another metal (19), e.g. a tin or indium based material, the two layers having volumes in a ratio different from that in the eutectic alloy formed by silver and that metal, and raising the temperature of the layers above the melting point of the eutectic alloy for a period sufficient to cause initially formation of the eutectic alloy and then, by reaction between the eutectic alloy and one or other of silver and the other metal, formation of a material having a melting point higher than the eutectic alloy melting point. The method allows soldering, e.g. of a silicon wafer (1) to a header (3), at a relatively low temperature below that which the joint will withstand after formation.
REFERENCES:
patent: 3769101 (1973-10-01), Woodward
patent: 4826787 (1989-05-01), Muto et al.
"Applications of solid-liquid Interdiffusion (SLID) bonding in integrated-circuit applications", by L. Bernstein et al., Transactions of the Metallurgical Society, vol. 236, Mar. 1966, pp. 405-412.
"Semicondcutor joining by the Solid-Liquid-Interface (SLID) Process", by L. Bernstein, Journal of Electrochemical Society, vol. 113, No. 12, Dec. 1966, pp. 1282-1288.
Humpston Giles
Jacobson David M.
Heinrich Samuel M.
Marconi Electronic Devices Limited
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