Metal fusion bonding – Process – Using bond inhibiting separating material
Patent
1992-10-21
1994-01-04
Bradley, Paula A.
Metal fusion bonding
Process
Using bond inhibiting separating material
228209, B23K 120
Patent
active
052753280
ABSTRACT:
This method enables two components (1, 3) to be joined by soldering using heat generated by a laser beam, without the use of flux. A layer (5) of a material which has a lower melting point than the material of one of the components (3) is formed on that component and forms a bond therewith on resolidifying after melting. Solder (7) is interposed between the layer (5) and the other component (1) to form, on resolidification after melting, bonds with the material of the layer (5) and the other component (1). A coating (11) of a further material between the layer (5) and the solder (7) is dispersed when the adjacent layer material becomes molten and is not wetted by the solder (7) when molten. On applying heat to a region (15) of the layer using a laser beam, the layer is melted in this region (15) as is the adjacent solder (7) to form, on resolidification of the solder (7) and molten layer material (15 ), bonds between the solder (7) and the two components (1, 3).
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Bass Kevin
Lodge Kevin J.
Logan Elizabeth A.
Bradley Paula A.
GEC--Marconi Limited
Mah Chuck Y.
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