Solid material comminution or disintegration – Processes – With heating or cooling of material
Patent
1994-12-15
1996-11-05
Nakarani, D. S.
Solid material comminution or disintegration
Processes
With heating or cooling of material
106400, 106403, 106415, 359580, 359585, 4273722, 4273835, 4273837, 428403, 428404, 428457, 428469, C09C 162
Patent
active
055708471
ABSTRACT:
A method of heat-treating multilayer interference platelets to improve the durability of the platelets comprising subjecting the platelets at a temperature of 200.degree.-300.degree. C. for 10 minutes to 24 hours. The platelets are formed from a multilayer interference thin film construction comprising a metal reflecting layer having a multilayer interference thin film structure on both sides of the metal reflecting layer wherein the multilayer interference thin film structure comprises a pair of layers consisting of a dielectric layer and a semi-opaque metal layer with the dielectric layer of the pair being directly adjacent to the metal reflecting layer.
REFERENCES:
patent: 3087838 (1963-04-01), Linton
patent: 3123489 (1964-03-01), Bolomey et al.
patent: 3123490 (1964-03-01), Bolomey et al.
patent: 3374105 (1968-03-01), Bolomey
patent: 3410626 (1968-11-01), Magrath
patent: 3858977 (1975-01-01), Baird et al.
patent: 4168986 (1979-09-01), Venis, Jr.
patent: 4216018 (1980-08-01), Bilofsky et al.
patent: 4434010 (1984-02-01), Ash
patent: 4705356 (1987-11-01), Berning et al.
patent: 5059246 (1991-10-01), Phillips et al.
patent: 5171363 (1992-12-01), Phillips et al.
patent: 5279657 (1994-01-01), Phillips et al.
Coombs Paul G.
Fisher Shari P.
Phillips Roger W.
Chen Vivian
Flex Products, Inc.
Nakarani D. S.
LandOfFree
Methods of heat-treating miltilayer inteference platelets does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of heat-treating miltilayer inteference platelets, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of heat-treating miltilayer inteference platelets will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2008836