Methods of forming two-sided HDMI interconnect structures

Details Methods of forming two-sided HDMI interconnect structures Methods of forming two-sided HDMI interconnect structures

1996-10-28

1997-11-25

Picardat, Kevin

Fishing, trapping, and vermin destroying

437214, 437217, H01L 2160

Patent

active

056912455

ABSTRACT:
Methods of forming two-sided high density multilayer interconnect (HDMI) structures on a relatively large carrier and subsequently releasing and removing one or more structures to provide useable flexible interconnects or decals. In general, a carrier is provided and a release layer is formed on the carrier. Flexible high density multilayer interconnect structures are fabricated on the release layer. The release layer is processed to release and remove one or more flexible HDMI structures from the carrier. The carrier may be an ultraviolet transparent substrate, such as quartz, for example, and the release layer may be a polyimide layer. The HDMI structures are released by irradiating the release layer through the transparent carrier using ultraviolet radiation from an ultraviolet radiation source. Alternatively, a silicon carrier may be used that has a metal or silicon dioxide release layer formed thereon. The HDMI structures are released from the metal or silicon dioxide release layer by using wet etching procedures.

REFERENCES:
patent: 4980034 (1990-12-01), Voleson et al.
patent: 5039628 (1991-08-01), Carey
patent: 5192716 (1993-03-01), Jacobs
patent: 5196362 (1993-03-01), Suzuki
patent: 5262351 (1993-11-01), Bureau et al.
patent: 5352926 (1994-10-01), Andrews
patent: 5400220 (1995-03-01), Swamy
patent: 5514613 (1996-05-01), Santadrea

Affiliated with

Also associated with

Rating

Methods of forming two-sided HDMI interconnect structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of forming two-sided HDMI interconnect structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of forming two-sided HDMI interconnect structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2106584