Methods of forming semiconductor chip underfill anchors

Details Methods of forming semiconductor chip underfill anchors Methods of forming semiconductor chip underfill anchors

2010-03-10

2011-11-15

Lee, Cheung (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S106000, C438S637000, C438S708000, C257SE21502, C257SE21577

Reexamination Certificate

active

08058108

ABSTRACT:
Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in an insulating layer applied to a side of a semiconductor chip. The first opening does not extend through to the side. A second opening is formed in the insulating layer that exposes a portion of the side.

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