Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-08-19
2009-11-10
Tucker, Philip C (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S249000, C385S126000
Reexamination Certificate
active
07615130
ABSTRACT:
Provided are methods of forming a printed circuit board having optical functionality. The methods involve: (a) providing a first, printed circuit board substrate; (b) forming an optical waveguide structure comprising a clad and a core structure on a second substrate separate from the printed circuit board substrate, wherein the optical waveguide structure comprises a silicon-containing material; (c) separating the optical waveguide structure from the second substrate; and (d) affixing the optical waveguide structure to the printed circuit board substrate. The invention has particular applicability in the electronics and optoelectronics industries for the formation of hybrid printed circuit boards.
REFERENCES:
patent: 5292620 (1994-03-01), Booth et al.
patent: 5402514 (1995-03-01), Booth et al.
patent: 5540799 (1996-07-01), Lebby et al.
patent: 5598501 (1997-01-01), Maruo et al.
patent: 5858051 (1999-01-01), Komiyama et al.
patent: 6144795 (2000-11-01), Dawes et al.
patent: 6440642 (2002-08-01), Shelnut et al.
patent: 6511615 (2003-01-01), Dawes et al.
patent: 6555288 (2003-04-01), Xu et al.
patent: 6731857 (2004-05-01), Shelnut et al.
patent: 7025849 (2006-04-01), Kim et al.
patent: 2002/1003605 (2002-03-01), Yoshimura et al.
patent: 2002/0135991 (2002-09-01), Doi
patent: 2003/0091926 (2003-05-01), Shelnut
patent: 2003/0099899 (2003-05-01), Gronbeck et al.
patent: 2003/0178118 (2003-09-01), Ishihara
patent: 2003/0209515 (2003-11-01), Pavelchek
patent: 2004/0022499 (2004-02-01), Shimizu et al.
patent: 2004/0047580 (2004-03-01), Shimada et al.
patent: 2004/0063026 (2004-04-01), Barr et al.
patent: 2004/0109950 (2004-06-01), Adams et al.
patent: 2004/0253535 (2004-12-01), Cameron et al.
patent: 2004/0265754 (2004-12-01), Barclay et al.
patent: 2005/0002631 (2005-01-01), Yamaguchi et al.
patent: 2006/0133755 (2006-06-01), Shelnut et al.
patent: 2006/0133756 (2006-06-01), Shelnut et al.
patent: 2006/0133766 (2006-06-01), Shelnut et al.
patent: 1 426 793 (2004-06-01), None
patent: 1 251 155 (2006-01-01), None
patent: 1994-258537 (1994-09-01), None
patent: 2003-195080 (2003-07-01), None
patent: 2003-195081 (2003-07-01), None
patent: 2003-202437 (2003-07-01), None
patent: WO 03/005616 (2003-01-01), None
patent: WO 2004/037866 (2004-05-01), None
Bhattacharya et al., “Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors”, Microelectronics Journal, vol. 32, No. 1, Jan. 2001, pp. 11-19.
Booth et al., “Low Loss Channel Waveguides in Polymers”, Journal of Lightwave Technology, IEEE Service Center, New York, vol. 7, No. 10, Oct. 1989, pp. 1445-1453.
Booth et al., “Polyguide Polymeric Technology for Optical Interconnect Circuits and Components”, vvww.opticalcrosslinks.com/pdf/photonics97.pdf, Photonics West, Conf. Proceedings, San Jose, CA, Feb. 12-14, 1997, vol. 3005, pp. 238-251.
J.T. Gallo et al., “High-Density Interconnects for 2-Dimensional VCSEL Arrays Suitable for Mass Scale Production”, www.optical crosslinks.com/pdf/HighDensityInterconnects8.pdf, ITCom 2001, Paper 4532-47, 2001.
B. Booth, “Polymers for Integrated Optical Waveguides”,Polymers for Electronic and Photonic Applications, C.P. Wang Ed., pp. 549-599, 1993, Academic Press.
Weber et al., “Light-Guiding Structures of Photoresist Films”, Appl. Phys. Lett., vol. 20, No. 3, Feb. 1972, pp. 143-145.
Optical Crosslinks, “Polymer Technology Overview”, www.opticalcrosslinks.com/pdf/WebPolymerTechnologyPlatform.pdf, 2001.
Knudsen Philip D.
Moynihan Matthew L.
Pugliano Nicola
Shelnut James G.
Baskin Jonathan D.
McClelland Kimberly K
Rohm and Haas Electronic Materials LLC
Tucker Philip C
LandOfFree
Methods of forming printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of forming printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of forming printed circuit boards will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4124743